Kazan, Russian Federation
Interphase interactions play a vital role in the vast majority of phenomena around us and are encountered in virtually all fields of science and industry. These interactions occupy a special place in various adhesive technologies. This review examines currently available methods and approaches for determining interactions at the interface of different phases. An absolutely accurate assessment of interphase interaction is impossible due to its "latent" nature; however, numerous approximate methods for this assessment are widely used in practice. This review distinguishes between the concepts of interfacial interaction, adhesive interaction, and adhesive strength, and examines the historical background to the emergence of methods for assessing interfacial (adhesive) interactions and their development. Testing the strength of adhesive bonds has experienced particularly rapid development due to the expanding use of polymeric materials with various substrates. Simultaneously, methods for assessing the quality of the resulting bond have been developed and refined. These methods are collectively known as adhesiometry, and each group is examined in detail. First, a review of traditionally used methods for measuring interfacial interactions is provided. It is noted that in recent years, particular attention has been paid in scientific publications to improving the testing devices themselves and determining the strength characteristics of modern adhesive bonds. The possibility of studying interfacial interactions using surface thermodynamic properties is also demonstrated. Next, a review of modern methods for assessing interfacial interactions is presented, among which atomic force microscopy is one of the main tools for studying interfacial adhesion. This method has become widely used in assessing adhesive interactions in composite materials. The review concludes with methods for testing the quality of adhesive joints, which have become increasingly popular recently-non-destructive testing methods. Such tests do not compromise the integrity of the system and can provide detailed information on the presence, size, and even visualization of defects.
INTERPHASE INTERACTIONS, ADHESION, ADHESIVE STRENGTH, WORK OF ADHESION, ADHESIVE BOND



