The processes of electrochemical and chemical nickel plating of aluminum, copper, and steel products have been studied. Methods for preparing the surfaces of these substrates, including degreasing, etching, and activation, have been developed. The mechanisms of coating formation have been experimentally studied, and the main parameters affecting the quality of the deposited nickel, such as current density and pH of the electrolyte, have been determined. The studies have shown high productivity and quality characteristics of the coatings obtained by the electrochemical method, with an optimal current density of 0.7 A/dm². The appearance of all the samples under study was characterized by a smooth, silver-gray surface, with no matte spots or other defects. The current yield coefficient showed that at a given current density (D = 0.7 A/dm²), the nickel plating efficiency was 90.67% for aluminum, 92.07% for copper, and 90.77% for steel. A comparative analysis of the deposition rates and thicknesses of coatings obtained by electrochemical and chemical nickel plating was conducted. The results of the study showed that the electrolyte of the galvanic coating is more stable for long-term use, without frequent adjustments of the concentration of the main components, compared to the solution of chemical nickel plating. The practical significance of the study lies in the development of effective technologies for metal coatings on aluminum, copper, and steel, which can improve the reliability and service life of products in challenging operating conditions.
ELECTROCHEMICAL NICKEL PLATING, COATING THICKNESS, ALUMINUM, COPPER, STEEL, ELECTROLYTES, ELECTROCHEMICAL PROCESS KINETICS, PRINTED CIRCUIT BOARDS



